iPhone X-12 Double-stacked Board Separation & Recombination | REWA Academy Tips

Just Recently, REWA Academy students provided feedback that the 2 layers commonly stop working to fit very closely in double-stacked motherboard repair work There are even large gaps, triggering pseudo soldering In reaction, we will certainly share suggestions and notes when dividing and recombining double-stacked motherboard Peel foam on the motherboard before home heating Please be noted that we do not suggest novices to heat up the motherboard with a hot air gun Due to the fact that the motherboard might obtain heat erratically and warp An expert motherboard heating system is what we recommend To facilitate later on elimination of the logic board, drive a screw on the logic board Cut through the tape with a Sculpture Blade The logic board as well as middle layer are soldered with low-temperature solder paste So the best temperature for the home heating platform will certainly be 155 ° C-165 ° C Press the reasoning board gently with tweezers when the temperature level gets to 165 ° C If the reasoning board is loose, the tin has thawed Clamp the screw to get rid of the reasoning board Eliminate the signal board Eliminate thermal oil with a Sculpture Blade Thermal grease must be removed entirely Or else, the thermal oil will certainly touch the reasoning board to give increase to pseudo soldering in recombination Connect the signal board to the holder Apply a round of Paste Change Get rid of tin on the bonding pad with Soldering Iron at 365 ° C and Solder Wick Tin on the bonding pad should be totally gotten rid of The recurring tin will influence the succeeding soldering Tidy the bonding pad with PCB Cleanser Clean the reasoning board with the very same approach Please do not damage components around the bonding pad of the reasoning board while cleaning It is required to check if the bonding pad is cool after cleaning up Connect the signal board to the Reballing System Put the reballing pattern ready to make certain that it is pushing against the signal board To avoid the solder paste from flowing right into the motherboard space, put a metal plate Use a layer of low-temperature Solder Paste Rub out excess solder paste with a Lint-free Wipe Eliminate the reballing pattern Examine if solder paste on the signal board is complete While applying solder paste, please ensure that solder paste should have a specific moisture If the solder paste is as well dry, it will certainly stick to the reballing stencil when the pattern is removed Consequently, the solder paste on the signal board will certainly not be consistent, which can quickly bring about inadequate soldering Placed the signal board on the 165 ° C Home heating System to warm Stop home heating after the solder spheres are developed Apply a little amount of Paste Change after the signal board has actually cooled Align the reasoning board with the signal board Keep heating on the 165 ° C Home Heating Platform When the solder flux spills as well as logic board sinks, nudge the logic board gently with tweezers to guarantee both layers fit carefully The push must be gentle as well as small Tidy the motherboard with PCB Cleanser after the motherboard has cooled If you discover the motherboard deformed while recombining, you can place the motherboard on a level board and also fasten it with an elastic band Press 2 sides of the motherboard delicately To avoid squashing parts, please put a soft paper under the motherboard Following, we will share another recombination technique The method can be taken if the center bonding pad is not harmed When the tin melts, remove the reasoning board in a vertical fashion with tweezers It can be seen that there is a steel pad of 0.05 mm density around the signal board at a certain range This metal pad is developed to maintain a 0.05 mm gap in between the reasoning board and also the center layer, stopping the solder rounds from connecting while soldering You only require to get rid of thermal grease on the motherboard when the repair service is done Keep initial tin on the bonding pad Use a tiny amount of Paste Change Finally, line up the logic board with the signal board When the temperature level reaches 165 ° C as well as the tin melts, transform the power off Press 2 ends of the logic board with tweezers until the motherboard has actually cooled The reasoning board and also the signal board fit carefully by doing this There will certainly be no connecting and also solder balls spillover Go to REWA Academy if you desire to learn more repair work skills We have total course bundles for motherboard diagnosis and also repair work capacity improvement Click the web link in the remark area to purchase motherboard repair work program bundles Thank you for enjoying as well as do not hesitate to leave a comment

Related posts